Tech Xplore

Direct approach can bond and debond 2D semiconductors without any glue-like materials

A key objective of electronics engineers is to further reduce the size of devices, while also boosting their speed, ...
IEEE

A 300-GHz-Band 40-Gb/s 2D Phased-Array CMOS Transmitter with Near-Half-Wave Antenna Pitch

Abstract: The free-space wavelengths in the 300-GHz band are so short that it is extremely challenging to realize phased arrays with a half-wave antenna pitch, required for preventing grating lobes.
IEEE

Single Die Process Using Shadow Masks for a 55µm Fine Pitch Array of 4µm-Tall Indium Bumps Across an Entire Chip

Abstract: Large area detectors for X-ray science, high energy physics and other radiation applications are generally assembled from multiple hybridized sensor/read-out chip modules. To minimize the ...
EurekAlert!

First 2D semiconductor FPGA achieves wafer-scale integration

Researchers at Fudan University have achieved a breakthrough by fabricating the first Field-Programmable Gate Array (FPGA) ...