Find out how innovative thermal interface materials outperform thermal grease by providing cleaner, more reliable, and higher ...

Thermal interface materials (TIMs) are becoming more important in all application areas and between different component parts. Any semiconductor, ranging from LEDs to high-power electronics, is ...

Electronic enclosures tend to have high thermal mass, which gives an opportunity to use them as a heat sink for a design. By ...

A top assignment a PCB designer is responsible for is to manage the heat generated by today’s large and small complex electronics components placed on a PCB. In effect, the PCB designer becomes a ...

Existing Thermal Interface Materials (TIM) technologies comprise phase change materials (PCMs), solders, thermal greases or pastes, and thermally conductive adhesive tapes. In routinely used thermal ...

Dublin, July 07, 2025 (GLOBE NEWSWIRE) -- The "Global Market for Thermal Management Systems and Materials for Advanced Semiconductor Packaging 2026-2036" report has been added to ...

Editor’s note: The following white paper is from an IMAPS conference in 2014 in San Diego presented by GaN Systems and AT&S. We were just granted permission to publish this paper. Large GaN ...

Advances in the development of high power and high performance electronic devices demand innovative approaches for heat transfer materials. While it is given that thermal performance must be maximized ...

A research team at the Korea Institute of Materials Science (KIMS) has developed a high-performance heat-dissipating ...

Electronic packaging has continued to become more complex with higher device count, higher power densities and Heterogeneous Integration (HI) becoming more common. In the mobile space, systems that ...