System-in-Package (SiP) technology has been used for a wide range of electronic devices, but the warpage behavior of the package can be difficult to control and predict due to complex manufacturing ...

SimForm has been a game-changer in injection molding, offering users the ability to quickly & easily predict temperatures, optimize cooling channel placement, and improve the quality of molded parts ...

The advantages of the injection/compression molding process for thermoset composite materials will be addressed as follows: 1) Thermoset composite history and transition of compression molding to ...