IBM Corp. is collaborating with several leading packaging and test services providers to market the second generation of its Surface Laminar Circuit flip-chip packaging technology. IBM will supply ...

Smart phones are a rapidly growing share of mobile phone shipments, representing 15% of the market in 2009 and growing to 35% in 2013. Essentially all the growth in mobile phone sales will come from ...

Flip chip packaging connects chips directly to boards using solder bumps, skipping the old wire bonding method for a more efficient link. The process involves making bumps on the chip, lining it up ...

Browse 40 market data Tables and 30 Figures spread through 80 Pages and in-depth TOC on "Ajinomoto Build-up Film Market - ...

Japanese IC substrate manufacturer Shinko Electric Industries has announced that due to poor sales of its main product, flip chip packaging substrates, the upcoming fiscal report for the fiscal year ...

A surge in demand for chips is impacting the IC packaging supply chain, causing shortages of select manufacturing capacity, various package types, key components, and equipment. Spot shortages in ...