Business Wire

Samsung Introduces Versatile New Flip Chip LED Packages and Modules

SEOUL, South Korea--(BUSINESS WIRE)--Samsung Electronics Co., Ltd., a world leader in advanced component solutions, today introduced a new lineup of flip chip LED packages and modules offering ...
Semiconductor Engineering

Physics-Based Digital Twin of a Thermally Aged Flip-Chip Package (TU Delft, NXP)

A technical paper titled “Modelling thermomechanical degradation of moulded electronic packages using physics-based digital twin” was published by researchers at Delft University of Technology and NXP ...
Nasdaq

Microchip’s RTG4™ FPGAs with Lead-Free Flip-Chip Bumps Achieve Highest Space Qualification

CHANDLER, Ariz., Oct. 17, 2024 (GLOBE NEWSWIRE) -- Satisfying mission assurance requirements for the most critical space programs, Microchip Technology’s (Nasdaq: MCHP) Radiation-Tolerant (RT) RTG4™ ...
Electronic Design

IEEE Honors Developers Of Flip-Chip Technology

Karl J. Puttlitz Sr. and Paul A. Totta have won the 2008 IEEE Components, Packaging and Manufacturing Technology Award. They are being recognized for their pioneering role in the establishment of flip ...
EDN

STMicroelectronics Increases Integration of Filtering and Protection, with New Flip-Chip IC Supporting 10 High

Geneva, October 09,2008 – By combining EMI filtering and ESD protection for 10 high-speed signal lines in a 1.98 x 2.08 mm flip-chip package, the EMIF10-LCD03F3 from STMicroelectronics (NYSE: STM), ...
EDN

Five times the ESD protection in a flip-chip suits wearables

The SP1012 series TVS diode array is the most densely designed ESD protection device on the market today. It packs five ESD diodes in a 0402-size (0.94 x 0.61-mm) flip-chip package that would normally ...