A new die-attach process promises to cool power devices up to 15X more efficiently while reducing failure-inducing stresses caused by conventional sintering techniques. QPT just filed a patent for the ...
Venkat Nandivada, Manager of Technical Support at Master Bond Inc, talks to AZoM about die attach adhesives used in semiconductor assembly. Beyond their ability to form a tight bond between die and ...
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QPT Solves Major Problem of Waste Heat Removal in Power Electronics with Novel Die Attach Process
The power electronics industry is facing a problem in that, as the power handled by transistors increases to meet the needs of new applications, the packaging will increasingly struggle to remove the ...
SINGAPORE--(BUSINESS WIRE)--Kulicke & Soffa Industries, Inc. (NASDAQ: KLIC) (“Kulicke & Soffa”, “K&S” or the “Company”), announced it has received a new order of its high-performance die attach ...
DUBLIN--(BUSINESS WIRE)--The "Die Attach Equipment - Global Market Outlook (2018-2027)" report has been added to ResearchAndMarkets.com's offering. The Global Die Attach Equipment market is expected ...
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